Tag Archives: Stacked Silicon Interconnect

Xilinx Ships Virtex-7 H580T Heterogeneous 3D FPGA

Xilinx Virtex-7 H580T FPGA - stacked silicon interconnect (SSI) technology and 28 Gbps transceivers on silicon separate from the core FPGA fabric

Xilinx has shipped the Virtex-7 H580T FPGA, which is the first 3D heterogeneous all programmable product. The Virtex-7 H580T features eight 28 Gbps transceivers and plenty of logic capacity. The device is the only FPGA that can integrate additional line card functionality so designers can implement a dual 100G OTN transponder on a single chip.

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Highest Capacity FPGA: Xilinx Virtex-7 2000T Field Programmable Gate Array

The Xilinx Virtex-7 2000T Field Programmable Gate Array is the highest-capacity programmable logic device. The Virtex-7 2000T FPGA features two million logic cells, 6.8 billion transistors, 12.5Gb/s serial transceivers, and 2.5D Stacked Silicon Interconnect (SSI) technology. 2.5-D IC stacking results in capacities that otherwise wouldn’t be possible in an FPGA for at least another process generation. Initial engineering samples of Virtex-7 2000T FPGA devices are shipping now.

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Xilinx Stacked Silicon Interconnect Technology

Xilinx introduced stacked silicon interconnect technology that combines multiple FPGA die in a single package. With Xilinx’s stacked silicon interconnect technology, engineers can increase capacity, bandwidth and power savings for applications that require high-transistor and logic density, and high levels of computational and bandwidth performance. The technology enables designers to pack more FPGA resources (logic, memory, serial transceivers and processing elements) on a single FPGA device.

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