Microsemi introduced the IGLOO2 FPGA Evaluation Kit. The low-cost kit is a PCI Express (PCIe) compliant form factor evaluation platform. The IGLOO2 FPGA Evaluation Kit is available now for an introductory price of $99 (for the first 1,000 orders). The kit includes Microsemi’s Libero SoC Gold Software License for designing with Microsemi FPGAs and SoC FPGAs.
ACCELIZE launched their XP7V690LP-40G low-profile FPGA computing card. The ACCELIZE XP7V690LP-40G features quad-10Gb Ethernet (40GbE) and PCI Express 3.0 with Gen3 speed. The ACCELIZE XP7V690LP-40G board accelerates real-time network processing and reduces latency. It is ideal for networking and financial applications. The ACCELIZE XP7V690LP-40G FPGA network accelerator card is available now in limited quantities. Full volume production is expected this quarter.
The XpressV7-LP is PLDA’s latest FPGA design kit. The XpressV7-LP features a FPGA-based low-profile PCI Express form factor card with 40Gb of Ethernet connectivity and 8 GBytes of DDR3 SDRAM. The FPGA kit is delivered with PLDA’s PCIe 3.0 IP and optional 10G UDP/TCP stack IP, specifically optimized for the Xilinx Virtex-7 FPGA. The PLDA XpressV7-LP FPGA Design Kit will ship in October.
PLDA introduced their XpressGX5LP FPGA design kit. It is the first FPGA-based low-profile PCI Express form factor card featuring 40Gb of Ethernet connectivity and 8 GBytes of DDR3 SDRAM. It is delivered with PLDA’s PCIe 3.0 IP and full hardware 10G TCP stack IP, specifically optimized for the Altera Stratix V FPGA. The PLDA XpressGX5LP is shipping now and will available for volume orders in Q3 2012.
Xilinx have created PCI Express x8 Gen3-based designs. The solution features the Virtex-7 field programmable gate array integrated block. All the elements needed for PCI Express x8 Gen3-based designs are now available, including the Virtex-7 X690T FPGA with an integrated PCI express block, ISE Design Suite 14.1 software tool support, a DMA engine provided by third-party Xilinx Alliance Program members, and a 1866 Mb/s DDR3 external memory interface.
Lattice Semiconductor will be attending Embedded World 2012. The event will take place in Nuremberg, Germany from February 28th to March 1st. Lattice will be demonstrating PCI Express solutions and camera solutions that are ideal for embedded, automotive and industrial applications. Lattice Semiconductor will be exhibiting in Hall 5, Stand 142.
Innovative Integration introduced their PEX6-COP FPGA co-processor card. The flexible board features an integrated FPGA computing core with an industry-standard FMC IO module on a half-length PCI Express desktop or server card. The FPGA computing core supports the Xilinx Virtex 6 FPGA family in densities up to LX550 and SX475. The SX475 offers over 2000 DSP MAC elements operating at up to 500 MHz. The FPGA core has two 9MB QDRII+ SRAM banks, two 256MB LPDDR2 DRAM banks, and a 128MB DDR3 bank. Each memory is directly connected to the FPGA and is fully independent.
Altera will be presenting, demonstrating, and showcasing at the Flash Memory Summit 2011. Altera will show how their FPGA devices enable new applications, including support for major interfaces used in flash memory applications such as multichannel ONFI and Toggle Mode, DDR3 memory, SAS/SATA protocols and the latest generation PCI Express (PCIe). The Flash Memory Summit 2011 will take place Tuesday, August 9 to Thursday, August 11, 2011 in Santa Clara, California.
According to Lattice Semiconductor, their solution is interoperable with existing PCIe 2.0 supported systems. At a recent PCI-SIG workshop, the LatticeECP3 FPGA and its PCI Express (PCIe) IP core passed PCI-SIG PCIe v2.0 compliance and interoperability testing for 1- and 4-lane configurations. As a result, the LatticeECP3 FPGA family is now compliant with the PCI Express 2.0 specification at 2.5Gbps. Lattice also worked with Trellisys on a PCIe Bus Functional Model (BFM) for Lattice’s PCI Express x1 and x4 IP Cores.
The new Acromag APCe8650 IndustryPack (IP) carrier cards feature an Altera Cyclone IV FPGA. The PCI Express carrier card routes power and bus signals to four IndustryPack mezzanine modules to create custom I/O processing boards. The modules are ideal for high-performance industrial, defense, and scientific research systems requiring high-density I/O. Prices start at $750 for the standard model. The -40 to 85°C extended temperature range version costs a little more.