Trenz Electronic introduced a new series of FPGA and SoC modules. The all-programmable SoMs are based on the latest Xilinx all-programmable devices (Artix, Kintex, and Zynq-7000 FPGA devices). They are available in a uniform 4cm x 5cm form factor. In addition, all modules and boards can be integrated and customized. Reference designs are available free of charge.
Mercury Computer Systems introduced the Echotek Series RFM-251-XMC Tuner and the Wideband DCM-V6-XMC Digital Transceiver. Both products feature a Xilinx Field-Programmable Gate Array. The Mercury mixed-signal modules offer outstanding SWaP characteristics for demanding RF applications. The new small form factor-based solutions detect, locate and capture signals in real-time across an extremely wide range of frequencies. The RFM 251 XMC Tuner and DCM-V5-6416-PCIe Digital Receiver improve the ability to anticipate threats and protect warfighters.
National Instruments announced six new adapter modules for their NI FlexRIO family. The modules feature FPGA-based reconfigurable I/O for general-purpose automated test and high-speed digital communication. The new FlexRIO adapter modules include four general-purpose digitizers, a module for high-speed digital I/O and a 16-bit analog-to-digital converter (ADC) from Analog Devices (ADI) that is optimized for modulated communications.
Acromag announced their VPX-VLX series of 3U VPX FPGA boards. The VPX-VLX features a Xilinx VLX85T, VLX110T, or VLX155T FPGA. The Xilinx Virtex-5 FPGA has been enhanced with multiple high-speed memory buffers and a high-throughput PCIe interface. The cards are available in a format designed for use in air-cooled or conduction-cooled systems suitable for -40 to 85°C operation. The Acromag modules start at $7100 with several options for FPGA logic capacity and conduction-cooled extended temperature operation.
S2C Inc. recently added seven new Prototype Ready modules to their library of pre-engineered hardware and software components. The pre-engineered solutions enable designers to quickly build SoC prototypes instead of creating and debugging custom target accessory boards. The new Prototype Ready accessories work out-of-box with the S2C’s TAI Logic Module series. When building SoC prototypes on FPGA, engineers can choose the TAI Logic Modules that fit their design capacity requirements and then select the interface modules from the Prototype Ready library that fit their application.
Impulse Accelerated Technologies will extend their C-to-FPGA compiler to support Pico Computing’s M-Series modules. The Pico modules feature the Xilinx Virtex-6 and Spartan-6 FPGA devices in a configuration that enables engineers to scale up from one to multiple modules. As a result, algorithms can be optimized for lower power, higher parallel-streaming operation on an FPGA, and then scaled to increase performance.
Altera announced the interoperability of the Stratix IV GT FPGAs with 40G Quad Small Form-Factor Pluggable (QSFP) optical modules from Avago Technologies. The 11.3-Gbps transceivers of the Stratix IV GT FPGAs enable designers to connect eight QSFP optical modules to a single FPGA and transport up to 320 Gbps of aggregate data in their system. Obtaining this same level of performance using FPGAs with sub-10-Gbps transceivers would normally require 32 SFP+ optical modules.
Pigeon Point Systems (PPS) introduced a Module Management Controller (MMC) Board Management Reference (BMR) Starter Kit for AdvancedMC (AMC) modules, which are used in both AdvancedTCA (ATCA) carriers and MicroTCA (uTCA) shelves, collectively referenced as xTCA. The MMC BMR Starter Kit is based on Actel’s SmartFusion intelligent mixed signal FPGAs. SmartFusion devices integrate an FPGA, hard ARM Cortex-M3-based microcontroller subsystem (MSS) and programmable analog.
siXis introduced the SXM100 module, SXM220 module, and the SXM100 Development Board. The SXM100 and SXM220 modules feature siXis’ patent-pending SiCB technology, which combines bare-die and passive components on large-area silicon substrates. The company also offers custom variations including different CPUs, FPGAs, memory, and oscillators. The SXM100 Embedded Computing Module and SXM100 Development Board engineering samples are available with a delivery of eight to ten weeks ARO. Engineering samples of the SXM220 Embedded Computing Module will be available starting in June 2010.
Trenz Electronic introduced the TE0320 family of FPGA-based industrial micromodules for harsh environments and pervasive deployment. The TE0320 micromodule featuers a Xilinx Spartan-3A-DSP FPGA, a USB 2.0 microcontroller, 128 MByte DDR RAM (32 bit wide), 4 MByte Flash memory for configuration and operation, and a switch-mode power supply for all on-board voltages. A large number of configurable I/Os are provided via standard board-to-board connectors. Customized versions, as well as modules with industrial-grade components are available on request.