Xilinx and Analog Devices have achieved JESD204B interoperability between Xilinx JESD204 LogiCORE IP in the Kintex-7 FPGA and the ADI AD9250 analog-to-digital high-speed data converter. The results confirm that off-the-shelf ADI JESD204B data converters and Xilinx FPGAs work together seamlessly. The interoperability means manufacturers can take advantage of JESD204B to accelerate time-to-market for their new products by shortening development time, reducing system test effort, and minimizing development issues.
Altera and Micron Technology have successfully demonstrated interoperability between Altera Stratix V FPGAs and Micron’s Hybrid Memory Cube (HMC). This technology achievement enables system designers to evaluate today the benefits of HMC with FPGAs and SoCs for next-generation communications and high-performance computing designs. The demonstration provides an early proof point that production support of HMC will be delivered with Altera’s Generation 10 portfolio — includes both Stratix 10 and Arria 10 FPGAs and SoCs.
Altera recently used their 28nm Stratix V GT FPGA devices to demonstrate interoperability with a 100-Gbps optical module. This is the first time a field programmable gate array has demonstrated interoperability with a 100-Gbps optical module. The Altera Stratix V GT FPGA’s interoperability with 100-Gbps optical module will enable next-generation 100-Gbps networks. This is of importance because more bandwidth will be required in the next few years because global Internet traffic expected to multiply dramatically.
Altera Stratix IV FPGAs passed the Interlaken Alliance’s device interoperability testing. Altera certified their FPGAs interface with third-party components using the Interlaken protocol. Stratix IV GT FPGAs passed interoperability testing at 6.25-Gbps line rates. According to Altera, their FPGA devices are the only Interlaken solution capable of supporting line rates of 10 Gbps. Device interoperability testing validates Stratix IV FPGAs for chip-to-chip Interlaken interface and ensures they can be quickly deployed as a turnkey solution for next-generation wireless and wireline infrastructure applications.