CommAgility introduced the AMC-V7-2C6678 Advanced Mezzanine Card (AMC) module. The AMC-V7-2C6678 features the latest Xilinx Virtex-7 FPGA and two Texas Instruments TMS320C6678 multicore DSPs. It includes Serial RapidIO (SRIO), Gigabit Ethernet and PCI Express. The AMC-V7-2C6678 DSP/FPGA Card is available now. It is ideal for high performance DSP/FPGA processing applications like telecoms and image processing.
Xilinx launched the new Zynq-7100 All Programmable SoC devices. The Zynq-7100 features an ARM processor and the industry’s highest performance digital signal processing (DSP). The device sets a new industry benchmark with greater than twice the signal processing capability of the most advanced All Programmable SoC available to date. The new member of the Zynq-7000 family is ideal for next-generation smart wireless, broadcast, medical and military applications.
RFEL announced a new family of video processing IP cores. The IP FPGA cores can be supplied with standard software interface frameworks to simplify their deployment. If required, RFEL can modify the cores to meet the requirements of constrained resources or legacy platforms. The new video processing FPGA IP cores are available now, either as standalone cores or as part of a system solution created by RFEL to meet a customer’s requirements.
Avnet Electronics Marketing Americas and MathWorks teamed on a new development kit. The tool combines a MathWorks software package with the Xilinx Kintex-7 FPGA DSP Development Kit with High-Speed Analog. The MathWorks Software Package for Xilinx DSP Kits is ideal for FPGA and DSP design engineers. It is available now from Avnet. Prices start at $13,995.
Innovative Integration recently introduced their X6-250M XMC module. The X6-250M features a Xilinx Virtex-6 FPGA signal processing core, XMC and PCI interfaces, and eight simultaneously sampling A/D channels. The X6-250M XMC module from Innovative Integration is ideal for software defined radio, RADAR receivers, and multi-channel data recorders.
Xilinx has increased the peak processing performance of their Zynq-7000 All Programmable SoC family to 1 GHz. In addition, the Zynq-7000 is now available in a smaller CLG225 form factor packaging (13 x 13mm) to enable higher system performance and programmable systems integration. The first Zynq-7045 device is currently shipping to Early Access customers. Broader availability will begin next quarter.
The LatticeECP4-190 FPGA is the highest density member of Lattice Semiconductor’s LatticeECP4 family. The LatticeECP4-190 FPGA features 183K LUTs, 480 double data rate DSP multipliers (18×18), 5.8 Mbits of memory and twelve 6 Gbps SERDES channels. The LatticeECP4-190 FPGA is shipping now to select customers. Volume shipment will be begin the second half of 2013. Prices for the device in the 676fcBGA package start at $60 in 100K unit volumes. The LatticeECP4-190 silicon is ideal for cost- and power-sensitive wireless, wireline, video and computing applications.
Altera, Arrow Electronics, and MathWorks are hosting the DSP Forum. The event will discuss application-specific digital signal processing design methodologies targeted for Altera FPGAs. DSP Forum will also explain how the combination of DSP Builder’s model-based design flow and MathWorks tools helps implement high-performance floating-point DSP. The one-day event will take place in multiple cities from May 1st to June 7th.
Avnet Electronics Marketing introduced the Xilinx Kintex-7 FPGA DSP Development Kit with High-Speed Analog. The new kit supports Xilinx’s 7 series Targeted Design Platforms. The Avnet includes the Xilinx Kintex-7 KC705 base board with Kintex-7 FPGA, 4DSP FMC 150 High-Speed ADC/DAC FMC, 12V power supply, Xilinx ISE Design Suite: System Edition, and Targeted Reference Designs (RTL and MathWorks model-based design tool flows). The Xilinx Kintex-7 FPGA DSP Development Kit is available for $3,995.
At DesignCon 2012, Altera will showcase how they are solving some of the industry’s most complex design challenges through 28nm FPGA architectural innovations and advanced technologies that enable high-speed I/O performance, floating point DSP and best-in-class signal integrity. Altera will participate on industry panels, conduct a TechForum tutorial and present nine conference papers. DesignCon will take place January 30 to February 2, 2012 at the Santa Clara Convention Center in California.