Tag Archives: ASSP

Xilinx SmartCORE IP Target ASIC and ASSP Gaps

Xilinx SmartCORE IP

Xilinx has been acquiring and developing a SmartCORE IP portfolio and a critical mass of application specialists and services that leverage Xilinx’s All Programmable FPGAs, SoCs, and 3D ICs. The company’s goal is to fill in the growing gaps in ASIC and ASSP offerings for next-generation smarter networks and data centers.

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Microsemi Offers Private Label Program for SmartFusion cSoC and FPGA

Microsemi announced a private labeling program for their SmartFusion customizable system-on-chip (cSoC), and flash and antifuse-based FPGA solutions. Microsemi’s new private label program enables companies to rapidly deliver economical and differentiated system-on-chip solutions. With the company’s SmartFusion cSoC devices, engineers can reduce the size of their circuit boards and the external bill-of-material component count while at the same time increasing the mean time between failure.

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Chip Path Semiconductor IP Centric Design for ASIC, FPGA, ASSP

Chip Path Design Systems introduced their new approach to semiconductor IP chip design. Their methodology focuses on a common Semantic-IC Specification with the ability to map to multiple implementation styles and understanding of complete project costs. Their Semiconductor IP Centric Design results in visibility of timelines and costs across ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), and production-ready ASSP (Application Specific Standard Product) devices.

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Xilinx to Accelerate FPGA Adoption

Xilinx is opening their platform and supporting FPGA industry standards. As part of their effort, Xilinx is making it easier for FPGA users to quickly find the right Xilinx Alliance Program partner for their specific design and development needs. Xilinx Alliance Program Members offers flexibility and cost of ownership benefits, while lowering design risks, over ASSP and ASIC solutions. The companies span many markets — such as IP, design and integration services, embedded software, design tools, development and evaluation boards, and complimentary silicon device technology.

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Xilinx 28nm High-Performance, Low-Power Process for FPGA Devices

The exorbitant cost of designing and manufacturing ASICs, rapidly evolving standards, the need to reduce bill of materials, and the need for both hardware and software programmability, all in the face of rough economic times and reduced staffing – are converging to create an environment where electronics product designers are increasingly looking to FPGAs as alternatives to ASICs and ASSPs. Xilinx calls the convergence of these trends the Programmable Imperative.

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SiliconBlue Technologies iCE65L01 mobileFPGA Device

SiliconBlue Technologies introduced the iCE65L01 mobileFPGA device. The iCE65L01 mobileFPGA device offers the benefits of programmability and time-to-market to handheld, mobile product designers. The ASIC-like cost, high logic capacity, ultra-low power, and advanced-package technology of the iCE65 devices provides the scalability required for designers to implement features that differentiate their products. The iCE65L01 features 1,280 logic cells and up to 93 user I/O pins.

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