Tag Archives: 3D IC

Xilinx SmartCORE IP Target ASIC and ASSP Gaps

Xilinx SmartCORE IP

Xilinx has been acquiring and developing a SmartCORE IP portfolio and a critical mass of application specialists and services that leverage Xilinx’s All Programmable FPGAs, SoCs, and 3D ICs. The company’s goal is to fill in the growing gaps in ASIC and ASSP offerings for next-generation smarter networks and data centers.

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Altera, TSMC Use CoWoS Process to Create Heterogeneous 3D IC Test Vehicle

Altera and TSMC teamed on a heterogeneous 3D IC test vehicle. The process uses TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) integration process. Altera is the first semiconductor company to develop and complete characterization of a heterogeneous test vehicle using TSMC’s CoWoS process. This and additional test vehicles enable Altera to quickly test the capabilities and reliability of 3D ICs to ensure they meet yield and performance targets.

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