Lattice Semiconductor ispMACH 4000ZE CPLD Family Goes Green

Lattice Semiconductor is offering halogen- and lead-free packages for their ispMACH 4000ZE CPLD family. The green products feature metal oxides or red phosphorous instead of bromine and chlorine, which are halogens associated with ozone depletion. Lead and halogens have been eliminated from several components of the ispMACH 4000ZE IC package material to comply fully with industry standards such as Japan’s JEIDA and Europe’s WEEE. For lead-frame based packages, the plating process has been modified to remove lead, and halogens have been removed from die-attach and mold compounds that encapsulate the IC.

Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Chip Array BGA (caBGA), Flip Chip BGA (fcBGA), and Quad Flat-pack Saw-singulated (QFNS). Lattice’s lead-free packages offer the same high quality and reliability benefits as devices that contain lead.

All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are now halogen free and use pure tin (Sn 100%) for lead plating.

Package Lead-Free Halogen-Free
48-Pin TQFP 4032ZE4064ZE
4032ZE4064ZE
64-Ball csBGA 4032ZE4064ZE
4032ZE4064ZE
64-Ball ucBGA 4064ZE
100-Pin TQFP 4064ZE4128ZE4256ZE
4064ZE4128ZE4256ZE
132-Ball ucBGA 4128ZE
144-Pin TQFP 4128ZE4256ZE
4128ZE4256ZE

Package Composition
TQFP Lead plating:Sn 100% (pure tin)
csBGA, ucBGA Solder ball composition:Sn 96.5% / Ag 3% / Cu 0.5%

More information: Lattice Semiconductor Lead Free, RoHS Compliant Packaging