Microsemi Extended Temperature Grade Fusion Mixed Signal FPGA

Fusion mixed signal FPGA device, from Microsemi, are now available with 100% temperature screening from -55 degrees C to +100 degrees C. The extended temperature Fusion field-programmable gate arrays are ideal for military, avionics, and defense industries, where highly reliable operation at extreme temperatures is needed. Extended temperature grade Fusion mixed signal FPGA devices are now available.

Extended Temperature Grade Fusion FPGA Highlights

  • Fully tested across the entire temperature range of -55 degrees C to +100 degrees C
  • Offered in two densities of 600K and 1.5M equivalent system gates
  • Up to 223 user I/O’s
  • Power sequencing and monitoring, supervision and monitoring of voltage, temperature and current can performed effortlessly at extreme temperatures
  • Ideal for weapons systems and “down wing” aircraft systems
  • Inherent reprogrammability, high reliability and nonvolatility
  • Firm error immunity
  • Analog and digital integration in a single chip
  • Reduces board space

More information: Microsemi