Actel Corporation (Nasdaq: ACTL) and UMC (NYSE: UMC, TSE: 2303) have teamed together for the production of Actel’s next generation flash-based FPGAs (field programmable gate array). The chips will be manufactured on UMC’s 65nm low leakage process, and will take advantage of the foundry’s 65nm embedded flash (eFlash) technology. Successful first-silicon demonstration of Actel’s 65nm eFlash-based FPGA has already been achieved at UMC’s 300mm Fabs.
UMC’s 65nm CMOS technology is in volume production at the company’s two 300mm fabs, with yield-proven customer products from all major sectors of the semiconductor industry. UMC’s 65nm embedded flash technology is ready for customer design-in, with key modules ready and working silicon already achieved.
Compared to earlier products built on the 0.13-micron process node, UMC’s 65nm eFlash technology will allow Actel’s FPGAs to realize a 50% smaller cell size and a 3X speed gain to enable higher overall performance.