Microsemi Offers Private Label Program for SmartFusion cSoC and FPGA

Microsemi announced a private labeling program for their SmartFusion customizable system-on-chip (cSoC), and flash and antifuse-based FPGA solutions. Microsemi’s new private label program enables companies to rapidly deliver economical and differentiated system-on-chip solutions. With the company’s SmartFusion cSoC devices, engineers can reduce the size of their circuit boards and the external bill-of-material component count while at the same time increasing the mean time between failure.

cSoC and FPGA vs ASIC and ASSP

Private Label Program Features

  • Microsemi Custom Marking
    Devices are marked with the customer’s logo and part number
  • Factory Programming
    Microsemi programs all devices, alleviating the need for customers to build in-house programming capabilities and infrastructure
  • Microsemi Licensing
    Microsemi’s SmartFusion cSoCs include a licensed, hard ARM Cortex-M3 processor, eliminating the need to obtain a separate ARM license
  • Fabless Model
    Private labeling eliminates the time and costs associated with establishing and managing a chip manufacturing infrastructure
  • No Tooling Charges
    No costly non-recurring engineering charges associated with Microsemi’s off-the-shelf SmartFusion cSoCs and FPGAs

Private Label Program Terms and Conditions

  • MOQ: 5,000 units per shipment increment
  • Sales are Non-Cancelable, Non-Returnable (NCNR)
  • Date code, wafer lot number, and COO (Country of Origin) required on all devices. This will be the bottom two lines of the marking.
  • Custom Mark Sample Approval Form and Custom Mark Agreement is required prior to production processing. The logo/mark must be provided in .jpg format. Upon approval of the logo/mark by Process Engineering, lead time is typically 2 weeks
  • Mechanical samples incur extra cost and cycle time

More info: Microsemi