Lattice Semiconductor announced automotive temperature qualified (AEC-Q100) low-cost Chip Scale 132 BGA (ball grid array) packaging for the non-volatile LatticeXP2 FPGA family. Production quantities of the new devices are available immediately. Lattice can provide standard PPAP (Production Part Approval Process) documentation to automotive customers requiring it. In 100K unit volume, the LA (Lattice Automotive) XP2-5 device is priced at $5.04.
The XP2 family’s new Chip Scale packaging enables realization of design requirements in the tightest form-factor automotive applications — such as automotive camera modules, telematics systems, parking assistance systems, and multimedia systems. The XP2 is based on Lattice’s 90 nanometer hybrid flexiFLASH technology.
The Chip Scale 132 BGA packaging has been fully qualified and characterized to meet AEC-Q100 requirements from the Automotive Electronics Council, and is available for the XP2-5 and XP2-8 devices, with five thousand and eight thousand LUTs (Look Up Tables) available, respectively. Measuring 64 mm2 and 1.35 mm in height, the package footprint is the smallest available for non-volatile FPGAs.
More information: Lattice Semiconductor